{
  "id": "inmp441",
  "name": "INMP441 I2S MEMS Microphone",
  "category": "ic",
  "family": "audio",
  "manufacturer": "TDK InvenSense",
  "mpn_pattern": "INMP441ACEZ-R7",
  "description": "TDK InvenSense INMP441 omnidirectional bottom-port MEMS microphone with 24-bit I2S output, 1.8-3.3V. The default ESP32 I2S mic. Footprint includes the required PCB sound hole (0.8mm NPTH) under the port ring - keep solder paste off the hole.",
  "parameters": {
    "contacts": 9,
    "mounting": "SMD",
    "supply_voltage": "1.8-3.3V",
    "interface": "I2S",
    "body_mm": "4.72x3.76x0.98"
  },
  "formats": [
    "kicad_mod",
    "kicad_sym",
    "step",
    "glb"
  ],
  "files": {
    "footprint": "https://partreel.com/library/ic/audio/inmp441/inmp441/inmp441.kicad_mod",
    "symbol": "https://partreel.com/library/ic/audio/inmp441/inmp441/inmp441.kicad_sym",
    "model_3d": "https://assets.partreel.com/library/ic/audio/inmp441/inmp441/inmp441.step",
    "preview": "https://assets.partreel.com/library/ic/audio/inmp441/inmp441/inmp441.glb",
    "footprint_svg": "https://partreel.com/library/ic/audio/inmp441/inmp441/inmp441.footprint.svg",
    "symbol_svg": "https://partreel.com/library/ic/audio/inmp441/inmp441/inmp441.symbol.svg"
  },
  "datasheet": "https://www.farnell.com/datasheets/1824785.pdf",
  "license": "CC-BY-4.0",
  "verified": true,
  "tier": null,
  "dimensions_source": "TDK DS-INMP441-00 Rev1.0: Fig.16 LGA_CAV 4.72x3.76x0.98; Fig.14 recommended land (1:1): 8 pads 0.4x0.6, columns 2.66 c-c, pitch 1.05, port ring ID0.96/OD1.56, PCB hole 0.5-1.0. Pinout Fig.3 (bottom view, mirrored for footprint).",
  "keywords": [
    "inmp441",
    "invensense",
    "mems",
    "microphone",
    "i2s",
    "esp32",
    "audio"
  ],
  "field_reports": {
    "worked": 0,
    "problem": 0
  },
  "provenance": {
    "dimensions_source": "TDK DS-INMP441-00 Rev1.0: Fig.16 LGA_CAV 4.72x3.76x0.98; Fig.14 recommended land (1:1): 8 pads 0.4x0.6, columns 2.66 c-c, pitch 1.05, port ring ID0.96/OD1.56, PCB hole 0.5-1.0. Pinout Fig.3 (bottom view, mirrored for footprint).",
    "datasheet": "https://www.farnell.com/datasheets/1824785.pdf",
    "generator_source": "https://github.com/mingyo186/partreel/blob/main/generators/gen_ics.py",
    "quality_gates": {
      "gates": [
        "validate_kicad (structure/pads/layers)",
        "KLC drawing rules (silk/fab/courtyard/pin1)",
        "check_overlap (text collisions)",
        "check_render (files/SVG-vs-source/meta completeness)",
        "check_zfight (3D coplanar faces, merged pins)",
        "validate_step (FreeCAD kernel isValid)"
      ],
      "enforcement": "CI runs all gates on every push and blocks deployment on any failure",
      "ci_config": "https://github.com/mingyo186/partreel/blob/main/.github/workflows/deploy.yml"
    },
    "field_reports": {
      "worked": 0,
      "problem": 0
    }
  },
  "page": "https://partreel.com/p/inmp441/",
  "api": "https://partreel.com/api/v1/parts/inmp441.json"
}