(footprint "IC_TPS65983BAZBHR"
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(layer "F.Cu")
	(property "Reference" "REF**"
		(at 0 -3.8 0)
		(unlocked yes)
		(layer "F.SilkS")
	)
	(property "Value" "IC_TPS65983BAZBHR"
		(at 0 4.1 0)
		(unlocked yes)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(stackup
		(layer "F.Cu")
		(layer "B.Cu")
		(layer "User.1")
		(layer "User.2")
		(layer "User.3")
		(layer "User.4")
		(layer "User.5")
		(layer "User.6")
		(layer "User.7")
		(layer "User.8")
		(layer "User.9")
	)
	(duplicate_pad_numbers_are_jumpers no)
	(fp_text user "${REFERENCE}"
		(at 0 5.2 0)
		(unlocked yes)
		(layer "F.Fab")
	)
	(fp_text user "Author: Antmicro"
		(at 0 6.2 0)
		(layer "F.Fab")
	)
	(fp_text user "License: Apache-2.0"
		(at 0 7.2 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -2.5 -2.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "A2" smd oval
		(at -2 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A3" smd oval
		(at -1.5 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A4" smd oval
		(at -1 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A5" smd oval
		(at -0.5 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A6" smd oval
		(at 0 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A7" smd oval
		(at 0.5 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A8" smd oval
		(at 1 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A9" smd oval
		(at 1.5 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A10" smd oval
		(at 2 -2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "A11" smd circle
		(at 2.5 -2.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B1" smd oval
		(at -2.5 -2)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "B2" smd circle
		(at -2 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B3" smd circle
		(at -1.5 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B4" smd circle
		(at -1 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B5" smd circle
		(at -0.5 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B6" smd circle
		(at 0 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B7" smd circle
		(at 0.5 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B8" smd circle
		(at 1 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B9" smd circle
		(at 1.5 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B10" smd circle
		(at 2 -2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "B11" smd oval
		(at 2.5 -2)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "C1" smd oval
		(at -2.5 -1.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "C2" smd circle
		(at -2 -1.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "C10" smd circle
		(at 2 -1.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "C11" smd oval
		(at 2.5 -1.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "D1" smd oval
		(at -2.5 -1)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "D2" smd circle
		(at -2 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D5" smd circle
		(at -0.5 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D6" smd circle
		(at 0 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D7" smd circle
		(at 0.5 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D8" smd circle
		(at 1 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D10" smd circle
		(at 2 -1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "D11" smd oval
		(at 2.5 -1)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "E1" smd oval
		(at -2.5 -0.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "E2" smd circle
		(at -2 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E4" smd circle
		(at -1 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E5" smd circle
		(at -0.5 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E6" smd circle
		(at 0 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E7" smd circle
		(at 0.5 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E8" smd circle
		(at 1 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E10" smd circle
		(at 2 -0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "E11" smd oval
		(at 2.5 -0.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "F1" smd oval
		(at -2.5 0)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "F2" smd circle
		(at -2 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F4" smd circle
		(at -1 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F5" smd circle
		(at -0.5 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F6" smd circle
		(at 0 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F7" smd circle
		(at 0.5 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F8" smd circle
		(at 1 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F10" smd circle
		(at 2 0 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "F11" smd oval
		(at 2.5 0)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "G1" smd oval
		(at -2.5 0.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "G2" smd circle
		(at -2 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G4" smd circle
		(at -1 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G5" smd circle
		(at -0.5 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G6" smd circle
		(at 0 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G7" smd circle
		(at 0.5 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G8" smd circle
		(at 1 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G10" smd circle
		(at 2 0.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "G11" smd oval
		(at 2.5 0.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "H1" smd oval
		(at -2.5 1)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "H2" smd circle
		(at -2 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H4" smd circle
		(at -1 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H5" smd circle
		(at -0.5 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H6" smd circle
		(at 0 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H7" smd circle
		(at 0.5 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H8" smd circle
		(at 1 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H10" smd circle
		(at 2 1 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "H11" smd oval
		(at 2.5 1)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "J1" smd oval
		(at -2.5 1.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "J2" smd circle
		(at -2 1.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "J10" smd circle
		(at 2 1.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "J11" smd oval
		(at 2.5 1.5)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "K1" smd oval
		(at -2.5 2)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "K2" smd circle
		(at -2 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K3" smd circle
		(at -1.5 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K4" smd circle
		(at -1 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K5" smd circle
		(at -0.5 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K6" smd circle
		(at 0 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K7" smd circle
		(at 0.5 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K8" smd circle
		(at 1 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K9" smd circle
		(at 1.5 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K10" smd circle
		(at 2 2 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "K11" smd oval
		(at 2.5 2)
		(size 0.25 0.17)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L1" smd circle
		(at -2.5 2.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(pad "L2" smd oval
		(at -2 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L3" smd oval
		(at -1.5 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L4" smd oval
		(at -1 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L5" smd oval
		(at -0.5 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L6" smd oval
		(at 0 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L7" smd oval
		(at 0.5 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L8" smd oval
		(at 1 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L9" smd oval
		(at 1.5 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L10" smd oval
		(at 2 2.5)
		(size 0.17 0.25)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_paste_margin_ratio 0)
	)
	(pad "L11" smd circle
		(at 2.5 2.5 270)
		(size 0.25 0.25)
		(layers "F.Cu" "F.Mask")
		(solder_paste_margin_ratio -0)
	)
	(embedded_fonts no)
	(model "antmicro_tps65983bazbhr.glb"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
