(footprint "antmicro_usb2422_i_mj"
  (version 20240108) (generator "partreel")
  (layer "F.Cu")
  (descr "QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm replacement land pattern per manufacturer datasheet: TI SCES682C land pattern drawing 4219135/B p.22 (verified by text+render+vector metrology; EP land 2.45 per actual RTW package, conservative for 2.45-2.6 EP variants)")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.65) (layer "F.SilkS"))
  (fp_text value "VAL**" (at 0 3.65) (layer "F.Fab"))
  (pad "1" smd rect (at -1.9 -1.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at -1.9 -0.75) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at -1.9 -0.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at -1.9 0.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at -1.9 0.75) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "6" smd rect (at -1.9 1.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "7" smd rect (at -1.25 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "8" smd rect (at -0.75 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at -0.25 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "10" smd rect (at 0.25 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "11" smd rect (at 0.75 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "12" smd rect (at 1.25 1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "13" smd rect (at 1.9 1.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "14" smd rect (at 1.9 0.75) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "15" smd rect (at 1.9 0.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "16" smd rect (at 1.9 -0.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "17" smd rect (at 1.9 -0.75) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "18" smd rect (at 1.9 -1.25) (size 0.6 0.24) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "19" smd rect (at 1.25 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "20" smd rect (at 0.75 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "21" smd rect (at 0.25 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "22" smd rect (at -0.25 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "23" smd rect (at -0.75 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "24" smd rect (at -1.25 -1.9) (size 0.24 0.6) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "25" smd rect (at 0 0) (size 2.45 2.45) (layers "F.Cu" "F.Paste" "F.Mask"))
)
