(footprint "ISP2053_8x8mm_LGA"
	(version 20260206)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "Insight SiP ISP2053-AX module, 8.0x8.0mm, 74 Pad, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.insightsip.com/iot-products/combo-smart-modules/isp2053")
	(tags "LGA 74")
	(property "Reference" "REF**"
		(at 0 -5 0)
		(layer "F.SilkS")
	)
	(property "Value" "ISP2053_8x8mm_LGA"
		(at 0 5 0)
		(layer "F.Fab")
	)
	(attr smd)
	(duplicate_pad_numbers_are_jumpers no)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "A1" smd roundrect
		(at -3.35 -3.35)
		(size 0.6 0.6)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A2" smd roundrect
		(at -2.6 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A3" smd roundrect
		(at -1.95 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A4" smd roundrect
		(at -1.3 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A5" smd roundrect
		(at -0.65 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A6" smd roundrect
		(at 0 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A7" smd roundrect
		(at 0.65 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A8" smd roundrect
		(at 1.3 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A9" smd roundrect
		(at 1.95 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A10" smd roundrect
		(at 2.6 -3.35)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "A11" smd roundrect
		(at 3.35 -3.35)
		(size 0.6 0.6)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "B2" smd roundrect
		(at -2.6 -2.7)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "B3" smd roundrect
		(at -1.95 -2.7)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "B4" smd roundrect
		(at -1.3 -2.7)
		(size 0.4 0.4)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "B5" smd roundrect
		(at -0.65 -2.7)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "B6" smd roundrect
		(at 0 -2.7)
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		(roundrect_rratio 0.25)
	)
	(pad "B7" smd roundrect
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		(size 0.4 0.4)
		(property pad_prop_bga)
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	)
	(pad "B8" smd roundrect
		(at 1.3 -2.7)
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		(roundrect_rratio 0.25)
	)
	(pad "B9" smd roundrect
		(at 1.95 -2.7)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "B10" smd roundrect
		(at 2.6 -2.7)
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		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "C1" smd roundrect
		(at -3.25 -2.05)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "C2" smd roundrect
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		(roundrect_rratio 0.25)
	)
	(pad "C3" smd roundrect
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	)
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		(property pad_prop_bga)
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	)
	(pad "C5" smd roundrect
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		(property pad_prop_bga)
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	)
	(pad "C6" smd roundrect
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		(roundrect_rratio 0.25)
	)
	(pad "C7" smd roundrect
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		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "C8" smd roundrect
		(at 1.3 -2.05)
		(size 0.4 0.4)
		(property pad_prop_bga)
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	)
	(pad "C9" smd roundrect
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		(size 0.4 0.4)
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	)
	(pad "C10" smd roundrect
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		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "C11" smd roundrect
		(at 3.25 -2.05)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "D1" smd roundrect
		(at -3.25 -1.4)
		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "D2" smd roundrect
		(at -2.6 -1.4)
		(size 0.4 0.4)
		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "D3" smd roundrect
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		(roundrect_rratio 0.25)
	)
	(pad "D4" smd roundrect
		(at -1.3 -1.4)
		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "D5" smd roundrect
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		(property pad_prop_bga)
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		(roundrect_rratio 0.25)
	)
	(pad "D6" smd roundrect
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	(pad "D7" smd roundrect
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		(roundrect_rratio 0.25)
	)
	(pad "D8" smd roundrect
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	(pad "D9" smd roundrect
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		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "D10" smd roundrect
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		(size 0.4 0.4)
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	)
	(pad "D11" smd roundrect
		(at 3.25 -1.4)
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		(roundrect_rratio 0.25)
	)
	(pad "E1" smd roundrect
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	)
	(pad "E2" smd roundrect
		(at -2.6 -0.75)
		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "E3" smd roundrect
		(at -1.95 -0.75)
		(size 0.4 0.4)
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		(roundrect_rratio 0.25)
	)
	(pad "E4" smd roundrect
		(at -1.3 -0.75)
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	)
	(pad "E5" smd roundrect
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	(pad "E6" smd roundrect
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	(pad "E7" smd roundrect
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	(pad "E8" smd roundrect
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	(pad "E9" smd roundrect
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	)
	(pad "E10" smd roundrect
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	)
	(pad "E11" smd roundrect
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	(pad "F1" smd roundrect
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	(pad "F2" smd roundrect
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	(pad "F3" smd roundrect
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	(pad "L1" smd roundrect
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	(pad "L11" smd roundrect
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	(zone
		(net 0)
		(net_name "")
		(layers "*.Cu" "Dwgs.User")
		(name "Keepout")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks not_allowed)
			(vias not_allowed)
			(pads allowed)
			(copperpour not_allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
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		(polygon
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				(xy 4.5 0.1)
				(xy 4.5 4.5)
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	(embedded_fonts no)
	(model "nordic_isp2053_ax.step"
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			(xyz 0 0 0)
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		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
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	)
)
