(footprint "antmicro_pac1954t_e_4mx"
  (version 20240108) (generator "partreel")
  (layer "F.Cu")
  (descr "VQFN-16-1EP_3x3mm_P0.5mm_EP1.1x1.1mm replacement land pattern per manufacturer datasheet: Microchip DS20006539F p.81 (drawing C04-2508 Rev A) recommended land pattern; EP land held at package EP nominal 1.10 for perimeter clearance (G1 0.45)")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.3) (layer "F.SilkS"))
  (fp_text value "VAL**" (at 0 3.3) (layer "F.Fab"))
  (pad "1" smd rect (at -1.45 -0.75) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at -1.45 -0.25) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at -1.45 0.25) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at -1.45 0.75) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at -0.75 1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "6" smd rect (at -0.25 1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "7" smd rect (at 0.25 1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "8" smd rect (at 0.75 1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at 1.45 0.75) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "10" smd rect (at 1.45 0.25) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "11" smd rect (at 1.45 -0.25) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "12" smd rect (at 1.45 -0.75) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "13" smd rect (at 0.75 -1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "14" smd rect (at 0.25 -1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "15" smd rect (at -0.25 -1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "16" smd rect (at -0.75 -1.45) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "17" smd rect (at 0 0) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
)
