(footprint "Bus_DDR3_SODIMM_TE_2-2013289-1"
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(layer "F.Cu")
	(property "Reference" "REF**"
		(at 0 -14.4 180)
		(layer "F.SilkS")
	)
	(property "Value" "Bus_DDR3_SODIMM_TE_2-2013289-1"
		(at 0 15.7 180)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
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		(layer "In1.Cu")
		(layer "In2.Cu")
		(layer "In3.Cu")
		(layer "In4.Cu")
		(layer "In5.Cu")
		(layer "In6.Cu")
		(layer "In7.Cu")
		(layer "In8.Cu")
		(layer "In9.Cu")
		(layer "In10.Cu")
		(layer "In11.Cu")
		(layer "In12.Cu")
		(layer "In13.Cu")
		(layer "In14.Cu")
		(layer "In15.Cu")
		(layer "In16.Cu")
		(layer "In17.Cu")
		(layer "In18.Cu")
		(layer "User.1")
		(layer "In19.Cu")
		(layer "User.2")
		(layer "In20.Cu")
		(layer "User.3")
		(layer "In21.Cu")
		(layer "User.4")
		(layer "In22.Cu")
		(layer "User.5")
		(layer "In23.Cu")
		(layer "User.6")
		(layer "In24.Cu")
		(layer "User.7")
		(layer "In25.Cu")
		(layer "User.8")
		(layer "In26.Cu")
		(layer "User.9")
		(layer "In27.Cu")
		(layer "In28.Cu")
		(layer "In29.Cu")
		(layer "In30.Cu")
		(layer "In31.Cu")
		(layer "In32.Cu")
	)
	(duplicate_pad_numbers_are_jumpers no)
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		(layer "F.Fab")
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	(fp_text user "${REFERENCE}"
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		(layer "F.Fab")
	)
	(fp_text user "Author: Antmicro"
		(at -36.8 20.1 0)
		(layer "F.Fab")
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	(pad "200" smd roundrect
		(at 30.45 4.22 180)
		(size 0.35 2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
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	(pad "201" smd roundrect
		(at 30.75 12.42 180)
		(size 0.35 2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
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	(pad "202" smd roundrect
		(at 31.05 4.22 180)
		(size 0.35 2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
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	(pad "203" smd roundrect
		(at 31.35 12.42 180)
		(size 0.35 2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "204" smd roundrect
		(at 31.65 4.22 180)
		(size 0.35 2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "SH" thru_hole circle
		(at -33.4 8.32 90)
		(size 2.5 2.5)
		(drill 1.65)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(pad "SH" smd roundrect
		(at -32.8 -3.68 180)
		(size 3.5 4.6)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1)
	)
	(pad "SH" smd roundrect
		(at 32.8 -3.68 180)
		(size 3.5 4.6)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1)
	)
	(pad "SH" thru_hole circle
		(at 33.4 8.32 90)
		(size 1.7 1.7)
		(drill 1.15)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(embedded_fonts no)
	(model "antmicro_2_2013289_1.glb"
		(offset
			(xyz 0 -4.57 2.65)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz -90 0 180)
		)
	)
)
